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Product

Micro Chip Visual Inspection System

■ WVS-MCi6CH

Micro Chip 의 외관상태를 고속으로 검사하는 장치입니다. 

A device that inspects the appearance of Micro Chip at high speed.

  

■ Chip : MLCC, LICC, Inductor, Chip-R, Filter and Similar Chip.
■ Chip Sizes(Inch/mm) : 01005(0402), 0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)
■ Scope : 6 Side inspection(Top, Front, Bottom, Rear, T1, T2 Insp.)
■ Defects : Chip outs, Cracks, Holes, De-lamination, Exposed Electrodes, Missing corners Surface contamination,                           Epoxy Hole, Scratches, Staight edges, Smears

■ Camera : 3CCD Color Camera (640×480)
■ Insp. Res.: 4.93 ㎛/pixel
■ Insp. Speed.: Max 8,000pcs/min
■ Eject Module : Pin Type Nozzle
■ Cleaning Module

■ WVS-RP3000

Reel에 포장된 Micro Chip 및 Reel Tape 상태를 고속으로 검사하는 장치입니다. 

A device that inspects Micro Chip and Reel Tape state packaged in Reel at high speed.

■ Chip : MLCC, Chip LED, SAW, TCXO, Crystal, Antenna etc. Various letters making chip

Chip Reel Size : Free size (Φ180-Φ300)
■ Scope : 3 Sided inspection (Top_1, Bottom, Top_2 Insp.)
■ Defects : Top_1 Insp. : Marking, Chip rotation, Reverse insert, No chip, Broken, Burr
                 Bottom Insp. : Carrier Tape Scratch
                 Top_2 Insp. : Cover Tape Floating, Cover Tape Bonding
■ Camera : Top_1 Insp. : 3CCD Color camera (640 x 480)
                 Bottom Insp.: 1CCD Mono camera (640 x 480)
                 Top_2 Insp. : 1CCD Mono camera (640 x 480)

■ Insp. Res. : 14.8 ㎛/pixel
■ Insp. Speed. : Max 3,000pcs/min
■ Eject Module : Pen Type
Optional: Sticker Label Marking

Micro Chip Auto Multiple Measurement System

■ WVS-AM100CIB

Micro Chip 의 특성(C/DF, IR, BDV)을 측정하는 장치입니다.

A device that measures Micro Chip properties (C/DF, IR, BDV)

 

■ Chip : MLCC
Chip Size(Inch/mm) : 02010603). 0402(1005), 0603(1608). 0805(2012), 1206(3216), 1210(3225)
Process Loading > Pick up > C/DF measurement > IR measurement > BDV measurement > Eject
Measurement Tester :                                                                                                                                       [C/DF Tester] – Keysight E4980A, Range : 101F-2mF                                                                                              [IR Tester] – Hioki SM7110, Range: 50Ω – 2X1019Ω                                                                                             [BDV Tester] – Matsusada HARD-5P60, Range: AC 100V – 120V, DC 1V – 5,000V
Measurement Speed : Max 8,5 pcs/sec (Measurement time excluded)
Automatic recognition & Pre-alignment using mono camera
Pick & Placement using nozzle

※C/DF : Capacitance/Dissipation Factor
※IR : Insulation Resistance
※BDV : Break Down Voltage

Micro Chip Multiple Pick & Placement System

■ WVS-MT300

Micro Chip 의 특성을 측정하기 위한 픽 & 플레이스먼트 장치입니다. 

A pick & placement device to measure the properties of Micro Chip

 

  

■ Chip : MLCC
Chip Size(Inch/mm) : 0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)
Process : Plate Loading > Pick up > Rotating > PCB Loading > Mounting
Mounting : Placement in 3 direction(T, W, L) using Rotation Unit
Mounting Speed : Max 7.0 pcs/sec
Automatic recognition & Pre-alignment using mono camera
Pick & Placement using nozzle

 

Film Inspection System

■ FAOI-FL05

Film 의 외관 상태를 고속으로 검사하는 장치입니다. 

A device that inspects the appearance of the film at high speed.

Insp. ModelFCCL Film (Flexible Copper Clad Laminate)
Scope : 1 Sided Inspection (TOP)
Defects : Dent, Scratch, Spot(Black Spot). Different Thing, Stain, Pin-Hole, Group defects, Periodic defects
■ Camera : 16K Mono Line Scan Camera (HS Link)
Insp. Res3.5 ㎛/pixel
Insp. Speed : Max 7 m/min

LCD & OLED Vision Inspection Module

■ WVS-AKKON

LCD & OLED Panel의 도전볼을 검사하는 장치입니다.

A device that inspects the conductive particles of the LCD & OLED Panel.

Insp. Model : COG & COF & TAB Bonding Panel : 3.5 inch – 42 inch

Panel Sized : 3.5 inch – 42 inch
■ Defects : The number, the strength, the length and the distribution of conductive particles
Insp. Camera / Res. : 4K TDI Mono Line Scan camera / 1.0 ㎛/pixel
 Align. Camera / Res. : 5M Mono Area Camera/3.5 ㎛/pixel
■ Insp. Speed : Max 55 mm/sec
Using x10 DIC(Differential Interference Contrast) Microscope

■ WVS-BONDER

LCD & OLED Panel과 Driver IC의 Bonding 상태를 검사하는 장치입니다. 

A device that inspects the bonding status of the LCD & OLED Panel and Driver IC.

■ Insp. Model : LCD & OLED Panel and Driver IC

Panel Sized : 3.5 inch – 42 inch
Defects : Driver IC recognition, Alignment
Insp. Camera / Res. : 5M Mono Area Camera / 1.0 ㎛/pixel
Camera / Res. : 5M Mono Area Camera / 3.5 ㎛/pixel
Insp. Speed : Max 55 mm/sec

군포 본사
104-1001, SK Ventium 166, Gosan-ro, Gunpo-si, Gyeonggi-do, 15850, Korea
(15850) 경기도 군포시 고산로 166, SK벤티움 104동 1001호   Tel : +82-31-429-2401 / Fax : +82-31-429-2405

안산 사무실
35, Emtibeui 4-ro 48beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, 15658, Korea
(15658) 경기도 안산시 단원구 엠티브이4로 48번길 35 (목내동)       Tel : +82-70-4694-2460

• Scope : 8 Sided inspection (Top-1(75°), Top-2(75°), Bottom-1(75°), Bottom-2(75°), Front, Rear, T1, T2 Insp.)
• Detect : Edge chipping + Same as WVS-MCi6CH
• Insp. Speed : Max 6,500 pcs/min
• Specialized in edge inspection of Micro Chip ※ Preparing to register a patent

• Scope : 6 Sided inspection + 2 Sided dimension measurement (Top, Front, Bottom, Rear, T1, T2, DT, DF Insp.)
• Detect : Length, Width, Thickness + Same as WVS-MCi6CH
• Insp. Speed : Max 5,000 pcs/min
• Measurement using 5M camera

• Scope : 6 Sided inspection + 1 Sided Mark Inspection + 2 Sided dimension measurement (Top, Front, Bottom, Rear, T1, T2, MT, DT, DF Insp.)
• Detect : Mark + Same as WVS-MCi6C2D
• Insp. Speed : Max 300 pcs/min
• Mark & Measurement using 5M camera

• Chip : MLCC's Green Chip(Bare Chip)
• Scope : 6 Sided inspection (Top, Front, Bottom, Rear, T1, T2 Insp.)
• Defects : Dimension (H, W), Chipping, Cline, Margin Size, Cover Size, Layer, Foreign Matter
• Insp. Speed : Max 1,500 pcs/min

• Scope : 2 Sided inspection(Top, Bottom)
• Camera :1CCD Color Camera (1600 x 1200) 2 set
• Insp. Res. :  8.8 ㎛/pixel
• Insp. Speed : Max 2,000 pcs/min

• Measurement Tester
[C/DF Tester] - Keysight E4980A, Range: 101F-2mF
[IR Tester] - Hioki SM7110. Range: 500 - 2X1019
• Measurement Speed : Max 7.0 pcs/sec (Measurement time excluded)
• Eject Box : 1 OK, 4 NG, 1 Reset
• Mark recognition & Alignment
• Inspection all Micro Chips

• Measurement Tester
[C/DF Tester] - Keysight E4980A, Range: 101F-2mF
[IR Tester] - Hioki SM7110. Range: 500 - 2X1019
• Measurement Speed : Max 7.0 pcs/sec (Measurement time excluded)
• Eject Box : 1 OK, 4 NG, 1 Reset
• Mark recognition & Alignment
• Inspection all Micro Chips

Measurement Tester : [C/DF Tester] - Keysight E4980A, Range: 101F-2mF
[BDV Tester] - Matsusada HARD 5P60, Range: AC 100V - 120V, DC 1V - 5,000V
• Measurement Speed : Max 6.0 pcs/sec (Measurement time excluded)
• Eject : 1 OK, 6 NG ※ Chip is returned to loading plate after testing

• Measurement Tester : [IR Tester] - Hioki SM7110, Range: 50Ω -2X1019Ω
[BDV Tester] - Matsusada HARD-5P50, Range : AC 100V - 120V, DC 1V - 5,000V
• Measurement Speed : Max 6.0 pcs/sec (Measurement time excluded)
• Eject : 1 OK, 6 NG ※Chip is returned to loading plate after testing

• Model : Fired chip(소성칩)
• Mounting speed : Max 6.0 pcs/sec
• Unloading plate : Pattern PCB
• Chip recognition & alignment

• Model : Green chip
• Mounting speed : Max 6.0 pcs/sec
• Unloading plate : Setter
• Recognition & Alignment

• Model : MLCC
• Mounting speed : Max 1.8 pcs/sec
• Unloading Plate : WPP, PCB
• Recognition & alignment

• Insp. Model : Copper FoilTM (Treatment Machine)
• Scope : 2 Sided Inspection (Top, Bottom)
• Top Insp. Res. : 25 ㎛/pixel
• Bottom Insp. Res. : 15 ㎛/pixel
• Insp. Speed : Max 25 m/min

• Insp. Model : Copper Foil SM (Slitting Machine)
• Scope : 2 Sided Inspection (Top, Bottom)
• Top Insp. Res. : 35 ㎛/pixel
• Bottom Insp. Res. : 35 ㎛/pixel
• Insp. Speed : Max 70 m/min

• Insp. Model Scope : Polyethylene Film
• Scope : 2 Sided Inspection (Top, Bottom)
• Top Insp. Res. : 35 ㎛/pixel
• Bottom Insp. Res. : 35 ㎛/pixel
• Insp. Speed : Max 80 m/min

• Insp. Model  : COG & COF & TAB Bonding Panel
• Panel Sized : 3.5 inch ~ 42 inch
• Defects : The number, the strength, the length and the distribution of conductive particles
• Insp. Camera / Res. : 4K TDI Mono Line Scan camera / 1.0 ㎛/pixel
• Align. Camera / Res. : 5M Mono Area Camera / 3.5 ㎛/pixel
• Insp. Speed : Max 55 mm/sec
•  Using x10 DIC(Differential Interference Contrast) Microscope

• Insp. Model  : LCD & OLED Panel and Driver IC
• Panel Sized : 3.5 inch ~ 42 inch
• Defects : Driver IC recognition, Alignment
• Insp. Camera / Res. : 45M Mono Area Camera / 1.0 ㎛/pixel
• Align. Camera / Res. : 5M Mono Area Camera / 3.5 ㎛/pixel
• Insp. Speed : Max 55 mm/sec